Male, National, and Religious Collective Narcissism Predict Sexism

Results of three cross-sectional studies indicate that sexism in Poland is associated with collective narcissism—a belief that one’s own group’s (the in-group’s) exaggerated exceptionality is not sufficiently recognized by others—with reference to three social identities: male, religious, and national. In Study 1 (n = 329), male collective narcissism was associated with sexism. This relationship was sequentially mediated by precarious manhood and traditional gender beliefs. In Study 2 (n = 877), Catholic collective narcissism predicted tolerance of violence against women (among men and women) over and above religious fundamentalism and in contrast to intrinsic religiosity. In Study 3 (n = 1070), national collective narcissism was associated with hostile sexism among men and women and with benevolent sexism more strongly among women than among men. In contrast, national in-group satisfaction—a belief that the nation is of a high value—predicted rejection of benevolent and hostile sexism among women but was positively associated with hostile and benevolent sexism among men. Among men and women collective narcissism was associated with tolerance of domestic violence against women, whereas national in-group satisfaction was associated with rejection of violence against women

Status and new layout of the ATLAS pixel detector

The ATLAS pixel detector is based on a set of radiation-hard electronics chips able to resist a dose of 500 kGy. The implementation of these chips in the DMILL technology did not give the expected results. Re-design of the radiation-hard chips in Deep SubMicron technology is ongoing, but has implied a one and a half year delay in an already tight schedule. Major layout changes have therefore been necessary to allow installation of the ATLAS pixel detector at LHC start-up. This paper illustrates the status of the ATLAS pixel project, die motivations for the new layout, the way this should be implemented and the prototype fabrication and testing. (4 refs)

Study of indium bumps for the ATLAS pixel detector

The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current status of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the indium bumps. (1 refs)

Results on 0.7% X0 thick pixel modules for the ATLAS detector

Modules are the basic building blocks of the ATLAS pixel detector system, they are made of a silicon sensor tile containing ~46000 pixel cells of 50 mu m*400 mu m, 16 front-end chips connected to the sensor through bump bonding, a kapton flex circuit and the module controller chip. The pixel detector is the first to encounter particles emerging from LHC interactions, minimization of radiation length of pixel modules is therefore very important. We report here on the construction techniques and on the operation of the first ATLAS pixel modules of 0.7% radiation length thickness. We have operated these modules with threshold of 3700*10+or-300*10, mean noise value of 225*10 and 0.3% dead channels. (3 refs)

Measurement of the D-s -> mu nu(mu) branching fraction and of the D-s decay constant

Using interactions of 350 GeV/c pi(-) in copper and tungsten targets, the branching fraction for the leptonic decay B(D-s --> mu v(mu)) is measured to he (0.83 +/- 0.23(stat.)+/- 0.06 +/- 0.18(B(Ds --> phi pi)))%. The resulting value for the D-s decay constant is f(D,) = 323 +/- 44 +/- 12 +/- 34. (C) 2000 Elsevier Science B.V. All rights reserved